Methods for protecting imaging elements of photoimagers...

Details Methods for protecting imaging elements of photoimagers... Methods for protecting imaging elements of photoimagers...

2011-04-05

2011-04-05

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S048000, C438S065000, C257SE21499, C257SE31117

Reexamination Certificate

active

07919348

ABSTRACT:
Methods for processing photoimagers include forming one or more protective layers over the image sensing elements of a photoimager. Protective layers may facilitate thinning of the substrates of photoimagers, as well as prevent contamination of the image sensing elements and associated optical features during back side processing of the photoimagers. Blind vias, which extend from the back side of a photoimager to bond pads carried by an active surface of the photoimager, may be formed through the back side. The vias may be filled with conductive material and, optionally, redistribution circuitry may be fabricated over the back side of the photoimager. Photoimagers including features at result from such processes are also disclosed.

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