Methods for producing submicron metal line and island arrays

Details Methods for producing submicron metal line and island arrays Methods for producing submicron metal line and island arrays

2005-04-05

2005-04-05

Chen, Bret (Department: 1762)

Coating processes

Immersion or partial immersion

Metal base

C427S304000, C427S123000, C427S162000, C427S164000, C427S443100, C427S305000

Reexamination Certificate

active

06875475

ABSTRACT:
This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.

REFERENCES:
patent: 3753816 (1973-08-01), Feldstein et al.
patent: 3882396 (1975-05-01), Schneider
patent: 5079600 (1992-01-01), Schnur et al.
patent: 5512131 (1996-04-01), Kumar et al.
patent: 6180239 (2001-01-01), Whitesides et al.
patent: 6406777 (2002-06-01), Boss et al.
patent: 6498114 (2002-12-01), Amundson et al.
patent: 6521285 (2003-02-01), Biebuyck et al.
patent: 6582767 (2003-06-01), Fukushima et al.
patent: 20030174384 (2003-09-01), Halas et al.

Affiliated with

Also associated with

Rating

Methods for producing submicron metal line and island arrays does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for producing submicron metal line and island arrays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for producing submicron metal line and island arrays will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3408292