Methods for producing packaged integrated circuit devices...

Details Methods for producing packaged integrated circuit devices... Methods for producing packaged integrated circuit devices...

2006-12-05

2006-12-05

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S051000, C438S116000

Reexamination Certificate

active

07144745

ABSTRACT:
A method of producing a crystalline substrate based device includes forming a microstructure on a crystalline substrate. At least one packaging layer is sealed over the microstructure by an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer.

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