Methods for producing packaged integrated circuit devices...

Details Methods for producing packaged integrated circuit devices... Methods for producing packaged integrated circuit devices...

2006-04-25

2006-04-25

Watkins, III, William P. (Department: 1772)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

C428S166000, C428S137000, C428S068000, C428S069000, C428S076000, C428S178000, C257S433000, C257S431000, C257S432000, C257S414000, C257S678000, C257S687000, C257S253000, C257S684000, C257S434000, C257S730000

Reexamination Certificate

active

07033664

ABSTRACT:
A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer and at least one opening in the packaging layer communicating with the at least one gap.

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