Methods for producing large flat panel and conformal active...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S601000, C029S842000, C029S884000, C343S70000R, C343S767000, C343S792500, C343S785000, C156S285000

Reexamination Certificate

active

07631414

ABSTRACT:
Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

REFERENCES:
patent: H565 (1989-01-01), Ford et al.
patent: 6417747 (2002-07-01), Dearden et al.
patent: 6975016 (2005-12-01), Kellar et al.
patent: 6992629 (2006-01-01), Kerner et al.
patent: 7057563 (2006-06-01), Cox et al.
patent: 2005/0046510 (2005-03-01), Kerner et al.
patent: 2005/0224954 (2005-10-01), Kelly

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