Methods for producing integrated circuit devices

Details Methods for producing integrated circuit devices Methods for producing integrated circuit devices

1994-07-13

1996-08-20

Fourson, George

Fishing, trapping, and vermin destroying

437226, 437208, 437915, H01L 21302

Patent

active

055479065

ABSTRACT:
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.

REFERENCES:
patent: 2507956 (1950-05-01), Bruno et al.
patent: 2796370 (1957-06-01), Ostrander et al.
patent: 2851385 (1958-09-01), Palin et al.
patent: 4383886 (1983-05-01), Nakamura et al.
patent: 4794092 (1988-12-01), Soloman
patent: 4862249 (1989-09-01), Carlson
patent: 4900695 (1990-02-01), Tokahashi et al.
patent: 4971930 (1990-11-01), Fusaroli et al.
patent: 4984358 (1991-01-01), Nelson
patent: 5104820 (1992-04-01), Go et al.
patent: 5126286 (1992-06-01), Chance
patent: 5147815 (1992-09-01), Casto
patent: 5185295 (1993-02-01), Goto et al.
patent: 5266833 (1993-11-01), Capp
patent: 5292686 (1994-03-01), Riley et al.
patent: 5376235 (1994-12-01), Langly
patent: 5455455 (1995-10-01), Badehi
D. Richmond, Micro SMT Integrated Circuit Technical White Paper, Micro SMT, Inc., Jan. 25, 1993, pp. 1-15.
Tessera Compliant Chip, Technology Overview, Tessera System Building Blocks, San Jose, CA.
Background Information--R&D 100 Technology's Brightest Stars, Tessera System Building Blocks, San Jose, CA.

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