Methods for producing a light emitting semiconductor body...

Details Methods for producing a light emitting semiconductor body... Methods for producing a light emitting semiconductor body...

2001-03-02

2009-10-13

Blum, David S (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S029000, C257SE33060

Reexamination Certificate

active

07601550

ABSTRACT:
The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body.In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.

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