Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-05-12
1997-05-13
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
156 89, 216 33, 216 20, B44C 122
Patent
active
056289197
ABSTRACT:
A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.
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Bessho Yoshihiro
Hakotani Yasuhiko
Tomura Yoshihiro
Matsushita Electric - Industrial Co., Ltd.
Powell William
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