Methods for precise definition of integrated circuit chip edges

Details Methods for precise definition of integrated circuit chip edges Methods for precise definition of integrated circuit chip edges

1997-04-14

1999-07-20

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Groove

257686, H01L 2906

Patent

active

059259248

ABSTRACT:
Integrated Circuit ("IC") chips are formed with precisely defined edges and sizing. At the wafer processing level, trenches are lithographically etched in the kerf regions to define the edges of the IC chips on the wafer. The trenches are filled with insulating material, and upper level wiring and metallization is completed for the IC chips on the wafer. Further trenches are defined down to the filled previously formed trenches. The wafer is thinned from its bottom up to the filled trenches, and the insulating material therein is removed to separate the individual IC chips from the wafer. The precision of IC chip edge definition facilitates forming the IC chips into stacks more easily because many stack level alignment processes become unnecessary.

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