Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-10-17
2006-10-17
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S008000, C451S041000, C451S056000, C451S443000
Reexamination Certificate
active
07121921
ABSTRACT:
Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.
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Micro)n Technology, Inc.
Ojini Anthony
Perkins Coie LLP
Wilson Lee D.
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