Methods for planarization and encapsulation of micromechanical d

Details Methods for planarization and encapsulation of micromechanical d Methods for planarization and encapsulation of micromechanical d

1995-04-14

1996-04-02

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437 54, 437927, H01L 21784

Patent

active

055040268

ABSTRACT:
A method for fabricating a micromechanical device and a semiconductor circuit on a substrate includes the steps of forming the micromechanical device on a device area of the substrate, the micromechanical device being embedded in a sacrificial material, selectively depositing a planarization layer on the substrate in a circuit area thereof, forming the semiconductor circuit on the planarization layer in the circuit area and removing the sacrificial material from the embedded micromechanical device. In a preferred embodiment, the planarization layer is an epitaxial silicon layer. A protective cap may be formed over the micromechanical device, so that it is completely encapsulated and is thereby protected against particulate contamination.

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