Methods for placing substrates in contact with molten solder

Details Methods for placing substrates in contact with molten solder Methods for placing substrates in contact with molten solder

2011-04-05

2011-04-05

King, Roy (Department: 1733)

Metal fusion bonding

Process

Applying or distributing fused filler

C228S037000

Reexamination Certificate

active

07918383

ABSTRACT:
Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.

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