Methods for patterned deposition on a substrate

Details Methods for patterned deposition on a substrate Methods for patterned deposition on a substrate

1993-05-20

1995-01-10

Vargot, Mathieu D.

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

156635, 156643, 264 83, 427555, B05D 306

Patent

active

053804740

ABSTRACT:
A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.

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H. K. Shin et al, "Selective Low-Temperature Chemical Vapor Deposition of Copper from (Hexafluoroacetylacetonato) copper (I) trimethylphosphine, (hfa)CuP(Me).sub.3 ", Rev. Feb. 27, 1991, Communications, Adv. Mater 3, No. 5, pp. 246-248, (1991).

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