Methods for packaging circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361736, H05K 330

Patent

active

053136993

ABSTRACT:
Embodiments disclose modular packaged circuit-boards (plug-in "cards") packaged in like modules, and cooled along with a motherboard in an integrated design.

REFERENCES:
patent: 4700272 (1987-10-01), Bellamy

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods for packaging circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for packaging circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for packaging circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1964723

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.