Methods for packaging and encapsulating semiconductor device...

Details Methods for packaging and encapsulating semiconductor device... Methods for packaging and encapsulating semiconductor device...

2008-04-08

2008-04-08

Andujar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S787000, C257S668000

Reexamination Certificate

active

07354795

ABSTRACT:
Packaging and encapsulation methods include use of a tape substrate with a mold gate that includes an aperture and a support element that extends over at least a portion of the aperture. The tape substrate may be part of a strip. A semiconductor device is secured and electrically connected to the tape substrate. The resulting assembly is placed into a cavity of a mold, and encapsulant is introduced into the cavity through the mold gate of the tape substrate. Once the encapsulant has sufficiently hardened, the package assembly may be removed from the mold, and a sprue of residual encapsulant removed therefrom. If the package assembly is carried by a strip that carries other package assemblies, it may be removed from the strip.

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