Methods for packaging an image sensor and a packaged image...

Details Methods for packaging an image sensor and a packaged image... Methods for packaging an image sensor and a packaged image...

2005-05-27

2010-06-29

Quach, Tuan N. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C257S680000, C257S704000, C257SE31110

Reexamination Certificate

active

07745897

ABSTRACT:
An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The transparent cover is then glued to the image sensor at the metallic bumps. Electrical connections are formed between the image sensor and the substrate using, for example, conventional wire bonding techniques. The electrical connections are encapsulated within an epoxy for protection. In an embodiment, multiple image sensors are packaged together on the same substrate and separated into individually packaged image sensors by, for example, sawing.

REFERENCES:
patent: 6646289 (2003-11-01), Badehi
patent: 6737292 (2004-05-01), Seo
patent: 6777767 (2004-08-01), Badehi
patent: 6995462 (2006-02-01), Bolken et al.
patent: 7087464 (2006-08-01), Yu et al.
patent: 2005/0059188 (2005-03-01), Bolken et al.
patent: 2006/0087018 (2006-04-01), Chao et al.

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