Optical waveguides – With optical coupler – With alignment device
Reexamination Certificate
2007-07-12
2011-12-27
Pak, Sung (Department: 2874)
Optical waveguides
With optical coupler
With alignment device
Reexamination Certificate
active
08086082
ABSTRACT:
Mounting an electro-optical component (1) on a carrier substrate (2) in an accurate position with respect to an optical element (6), the carrier substrate and the electro-optical component each being provided with at least one solder pad (3, 4). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.
REFERENCES:
patent: 2004/0042729 (2004-03-01), Zhou et al.
patent: 2005/0156187 (2005-07-01), Isokawa et al.
patent: 2005/0167679 (2005-08-01), Ishii et al.
patent: 2005/0258445 (2005-11-01), Wu
patent: 0720241 (1996-07-01), None
patent: 1528602 (2005-05-01), None
patent: 2276492 (1994-09-01), None
patent: 10170769 (1998-06-01), None
patent: 2004004195 (2004-01-01), None
S.Lezekiel; “Microwave Photonic Multichip Modules”, Electronics and Comm. Eng. Journal, Institution of Electrical Eng, London, GB, vol. 9, No. 4, Aug. 1997, pp. 156-164, XP000733007.
C.A. Jones et al; “Hybrid Integration Onto Silicon Motherboards With Planar Silica Waveguides”, IEE Proceedings: Optoelectronics, Inst. of Electrical Eng., Stevenage, GB, vol. 143, No. 5, Oct. 1996, pp. 316-321, XP000680747.
K.P. Jackson; “A Compact Multichannel Transceiver Module Using Planar-Processed Optical Waveguides and Flip-Chip Optoelectronic Components”, Proc. of the Electronic Components and Tech. Conf. San Diego, May 18, 1992, vol. Conf. 42, pp. 93-97, XP000473970.
Michel De La Bachelerie et al; “MOEMS Devices and Their Applications to Optical Telecomunication System”, Annales Des Telecommunications—Annals of Telecomunications, Get Lavoisier, Paris, FR, vol. 58, No. 9/10, Sep. 2003, pp. 1401-1423, XP001186065.
De Samber Marc A.
Lenderink Egbert
Peters Ralph H.
Schug Josef A.
Koninklijke Philips Electronics , N.V.
Pak Sung
LandOfFree
Methods for mounting an electro-optical component in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for mounting an electro-optical component in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for mounting an electro-optical component in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4312631