Methods for manufacturing printed circuit boards using a...

Printing – Stenciling – Processes

Reexamination Certificate

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C101S123000

Reexamination Certificate

active

06840169

ABSTRACT:
An apparatus for preventing media deposition in predetermined locations comprising at least one blocking cap connected to a pressurized squeegee head is disclosed. In one embodiment, a method for partially printing a circuit board is disclosed. The method comprises inserting one or more blocking caps inside a pressurized squeegee head and printing with the pressurized squeegee head. In this way, defined areas on the surface of a stencil or screen, over which the blocking caps travel, are skipped. In another embodiment, a new method for manufacturing printed circuit boards is described, comprising placing a component on a circuit board, performing burn-in or testing of the component, partially printing attachment media on the circuit board with a pressurized squeegee head containing one or more blocking caps, and placing additional components on the circuit board. In one embodiment, the circuit board is sold or returned to the circuit board designer before performing the partial printing step.

REFERENCES:
patent: 5185040 (1993-02-01), Sakai et al.
patent: 5287806 (1994-02-01), Nanzai
patent: 5524537 (1996-06-01), van der Meulen
patent: 5786701 (1998-07-01), Pedder
patent: 5825629 (1998-10-01), Hoebener et al.
patent: 5868302 (1999-02-01), Onishi et al.
patent: 5909634 (1999-06-01), Hotchkiss et al.
patent: 5922496 (1999-07-01), Dalal et al.
patent: 5925187 (1999-07-01), Freeman et al.
patent: 6272984 (2001-08-01), Kato et al.
patent: 6286422 (2001-09-01), Lin et al.
“DEK: Refinements to the ProFlow Cassette”, http://www.dek.com/printing machines/products/proflow2/semco/default.htm. Semco products under license from DEK.,(Aug. 4, 1999), 6 pgs.
“Ultraprint 3000 HiE Series; Rheometric Pump Print Head”, http://www.mpmcorp.com/ultra3000/rheopump/rheopump faq a10.html, MPM Corporation 1998, (1998), 20 pgs.
Bell, Richard, “Enclosed Print Heads —The Only Alternative?”,IPC/SMTA Electronic Assembly Expo., 1998 Proceedings of the Technical Program, (1998),571-575.
Clasper, Simon, “Printing With Proflow Direkt Imaging”,Nepcon West 99 Proceeding, (Feb. 21-25, 1999),397-402.
Manessis, D., et al., “A Characterization Study of Direct Imaging Technique for Stencil Printing of Thick Boards (0.125″) in the Alternative Assembly and Reflow Technology (AART) or Pin-In-Paste Process”,23rd IEEE/CPMT International Electronic Manufacturing Technology Symposium, (Oct. 19-21, 1998),92-99.
Nauss, Ed, et al., “Rheometric Pump Print Head Technology”,Proceedings of the Technical Program NEPCON West Conference '98, vol. 1,(Mar. 1-5, 1998), 237-241.
Prasad, Ray P.,In: Surface Mount Technology, Principles and Practice,Kluwer Academic Publishers,(1997),31-50; 404-421.

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