Methods for manufacturing imprinted substrates

Details Methods for manufacturing imprinted substrates Methods for manufacturing imprinted substrates

2002-12-18

2009-12-29

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S846000, C174S262000

Reexamination Certificate

active

07637008

ABSTRACT:
A package includes at least one electronic component mounted on an imprinted substrate. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Such features may be formed by imprinting in one operation rather than sequentially. Conductor features, such as trenches, holes, and planes, may be formed of different sizes simultaneously. One or more vias may be formed in one or more trenches. Methods of fabricating an imprinted substrate, as well as application of the imprinted package to an electronic assembly, are also described.

REFERENCES:
patent: 2912748 (1959-11-01), Gray
patent: 2986804 (1961-06-01), Greenman et al.
patent: 3438127 (1969-04-01), Lehtonen
patent: 3628243 (1971-12-01), Phol et al.
patent: 4049903 (1977-09-01), Kobler
patent: 4584767 (1986-04-01), Gregory
patent: 4651417 (1987-03-01), Schumacher, III et al.
patent: 4704791 (1987-11-01), Chellis et al.
patent: 4912844 (1990-04-01), Parker
patent: 4941255 (1990-07-01), Bull
patent: 5043184 (1991-08-01), Fujii et al.
patent: 5048178 (1991-09-01), Bindra et al.
patent: 5091339 (1992-02-01), Carey
patent: 5259110 (1993-11-01), Bross et al.
patent: 5528001 (1996-06-01), Roberts
patent: 5830563 (1998-11-01), Shimoto et al.
patent: 5928767 (1999-07-01), Gebhardt et al.
patent: 6005198 (1999-12-01), Gregoire
patent: 6127196 (2000-10-01), Butera et al.
patent: 6156221 (2000-12-01), Lauffer et al.
patent: 6156870 (2000-12-01), Morita et al.
patent: 6254972 (2001-07-01), Farquhar et al.
patent: 6783652 (2004-08-01), Iijima et al.
patent: 6815709 (2004-11-01), Clothier et al.
patent: 6930256 (2005-08-01), Huemoeller et al.
patent: 7371975 (2008-05-01), Dory et al.
patent: 2003/0135998 (2003-07-01), Walz et al.
patent: 2004/0124533 (2004-07-01), Keser et al.
patent: 2008/0000674 (2008-01-01), Dory et al.
patent: 1279251 (2001-01-01), None
patent: 2212332 (1989-07-01), None
patent: 11-186698 (1999-07-01), None
patent: 2000-124581 (2000-04-01), None
patent: WO-01/50825 (2001-07-01), None
“Method to Control the Geometry and Vertical Profile of Via Holes in Substrate Materials”,IBM Technical Disclosure Bulletin, 35, (Oct. 1, 1992), 211-216.
Tormen, M. , et al., “Thermocurable Polymers as Resists for Imprint Lithography”,Electronics Letters, 36, (May 25, 2000), 983-984.
“U.S. Appl. No. 10/322,902 Final Office Action mailed Nov. 22, 2005”, 11 pgs.
“U.S. Appl. No. 10/322,902 Non-Final Office Action mailed Mar. 25, 2005”, 13 pgs.
“U.S. Appl. No. 10/322,902 Non-Final Office Action mailed Jun. 28, 2006”, 16 pgs.
“U.S. Appl. No. 10/322,902 Notice of Allowance mailed Jun. 11, 2007”, 9 pgs.
“U.S. Appl. No. 10/322,902 Response filed Apr. 24, 2006 in response to Final Office Action mailed Nov. 22, 2005”, 9 pgs.
“U.S. Appl. No. 10/322,902 Response filed Sep. 26, 2005 filed in response to Non-Final Office Action mailed Mar. 25, 2005”, 13 pgs.
“U.S. Appl. No. 10/322,902 Response filed Nov. 28, 2006 in response to Non-Final Office Action mailed Jun. 28, 2006”, 10 pgs.
“U.S. Appl. No. 10/335,187 Final Office Action mailed Mar. 9, 2005”, 9 pgs.
“U.S. Appl. No. 10/335,187 Non-Final Office Action mailed Sep. 15, 2004”, 9 pgs.
“U.S. Appl. No. 10/335,187 Response filed Jan. 17, 2006 in response to Non-Final Office Action mailed Sep. 15, 2005”, 14 pgs.
“U.S. Appl. No. 10/335,187 Response filed Jun. 9, 2005 in response to Final Office Action mailed Mar. 9, 2005”, 14 pgs.
“U.S. Appl. No. 10/335,187 Final Office Action mailed Feb. 3, 2004”, 9 pgs.
“U.S. Appl. No. 10/335,187 Final Office Action mailed Mar. 23, 2006”, 9 pgs.
“U.S. Appl. No. 10/335,187 Non-Final Office Action mailed Sep. 15, 2005”, 8 pgs.
“U.S. Appl. No. 10/335,187 Non-Final Office Action mailed Sep. 16, 2003”, 7 pgs.
“U.S. Appl. No. 10/335,187 Response filed May 3, 2004 in response to Final Office Action mailed Feb. 3, 2004”, 12 pgs.
“U.S. Appl. No. 10/335,187 Response filed Nov. 17, 2003 in response to Non-Final Office Action mailed Sep. 16, 2003”, 12 pgs.
“U.S. Appl. No. 10/335,187 Response filed Dec. 15, 2004 in response to Non-Final Office Action mailed Sep. 15, 2004”, 18 pgs.
“U.S. Appl. No. 10/322,902, Non-Final Office Action Mailed Nov. 26, 2007”, 19 pgs.
“U.S. Appl. No. 10/322,902 Amendment Under 37 CFR 1.312 filed Jan. 21, 2008”, 7 pgs.
“U.S. Appl. No. 10/322,902, Notice of Allowance Mailed Jan. 8, 2008”, 9 pgs.
“U.S. Appl. No. 10/322,902, Response filed Jan. 17, 2005 to Restriction Requirement mailed Dec. 15, 2004”, 9 pgs.
“U.S. Appl. No. 10/322,902, Restriction Requirement Received mailed Dec. 15, 2004”, 5 pgs.
“U.S. Appl. No. 10/335,187 Response filed Jun. 27, 2008 to Non-Final Office Action mailed Mar. 27, 2008”, 13 pgs.
“U.S. Appl. No. 10/335,187, Appeal Brief filed Sep. 21, 2006”, 18 pgs.
“U.S. Appl. No. 10/335,187, Non-Final Office Action mailed Mar. 27, 2008.”, 7 pgs.
“U.S. Appl. No. 10/335,187, Reply Brief filed Jun. 13, 2006”, 5 pgs.
“U.S. Appl. No. 10/335,187 Final Office Action mailed Oct. 8, 2008”, 9pgs.
“U.S. Appl. No. 11/853,856, Response filed Apr. 7, 2009 to Non Final Office Action mailed Feb. 6, 2009”, 13 pgs.
“U.S. Appl. No. 11/853,856 Non-Final Office Action mailed Feb. 6, 2009”, 12 pgs.

Affiliated with

Also associated with

Rating

Methods for manufacturing imprinted substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for manufacturing imprinted substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for manufacturing imprinted substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4064196