Methods for manufacturing compound-material wafers and for...

Details Methods for manufacturing compound-material wafers and for... Methods for manufacturing compound-material wafers and for...

2006-06-21

2008-07-29

Dang, Trung (Department: 2892)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S795000

Reexamination Certificate

active

07405136

ABSTRACT:
This invention provides methods for manufacturing compound-material wafers and methods for recycling donor substrates that results from manufacturing compound-material wafers. The provided methods includes at least one further thermal treatment step configured to at least partially reduce oxygen precipitates and/or nuclei. Reduction of oxygen precipitates and/or nuclei, improves the recycling rate of the donor substrate.

REFERENCES:
patent: 6211041 (2001-04-01), Ogura
patent: 6492682 (2002-12-01), Akiyama et al.
patent: 6596610 (2003-07-01), Kuwabara et al.
patent: 2001/0029072 (2001-10-01), Kuwahara
patent: 2003/0170990 (2003-09-01), Sakaguchi et al.
patent: 2003/0219957 (2003-11-01), Kuwabara et al.
patent: 2004/0031979 (2004-02-01), Lochtefeld et al.
patent: 2004/0187769 (2004-09-01), Aoki
patent: 2005/0032376 (2005-02-01), Seuring et al.
patent: 2005/0112845 (2005-05-01), Ghyselen et al.
patent: 2005/0202658 (2005-09-01), Neyret
patent: 1 087 041 (2001-03-01), None
patent: 11297583 (1999-10-01), None
patent: WO 2005/014895 (2005-02-01), None
patent: WO 2005/086227 (2005-09-01), None

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