Methods for manufacturing a sensor assembly

Details Methods for manufacturing a sensor assembly Methods for manufacturing a sensor assembly

2011-03-15

2011-03-15

Banks, Derris H (Department: 3729)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C029S830000, C029S842000, C029S846000, C029S605000, C029S602100, C257S780000, C257S737000, C174S262000, C438S118000

Reexamination Certificate

active

07906364

ABSTRACT:
A method for connecting substrates having electrical conductive elements thereon, comprising: providing at least one spacer between the substrates; applying a conductive material to at least one of the electrical conductive elements; aligning the electrical conductive elements; and, connecting the substrates by urging them together, wherein the at least one spacer prevents lateral spreading of the conductive material on the substrates from bridging a distance between adjacent conductive elements during the connecting.

REFERENCES:
patent: 4607779 (1986-08-01), Burns
patent: 5136125 (1992-08-01), Russell et al.
patent: 5700715 (1997-12-01), Pasch
patent: 5941449 (1999-08-01), Le Coz et al.
patent: 6281452 (2001-08-01), Prasad et al.
patent: 6569753 (2003-05-01), Akram et al.
patent: 6621168 (2003-09-01), Sundahl et al.
patent: 6690156 (2004-02-01), Weiner et al.
patent: 6773957 (2004-08-01), Farnworth et al.
patent: 7566649 (2009-07-01), Bernier et al.
patent: 2004/0095333 (2004-05-01), Morag et al.
patent: 2007/0292983 (2007-12-01), Kriman et al.
patent: 4242408 (1993-06-01), None
patent: 0710058 (1996-01-01), None
patent: 0710058 (1996-05-01), None
patent: WO 2006/056999 (2006-06-01), None
International Preliminary Report on Patentability Dated Mar. 12, 2007 From the International Preliminary Examining Authority Re.: Application No. PCT/IL2005/001271.
International Search Report and the Written Opinion Dated Jul. 31, 2006 From the International Searching Authority Re.: Application No. PCT/IL2005/001271.

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