Methods for manufacture of multilayer circuit boards

Details Methods for manufacture of multilayer circuit boards Methods for manufacture of multilayer circuit boards

1991-06-07

1992-08-11

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205135, 205191, 205210, 427 98, 430312, C25D 502

Patent

active

051376180

ABSTRACT:
The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques. The method may also be used in single-sided and double-sided circuit board fabrication and for inner layers used in multilayer circuit boards.

REFERENCES:
patent: 4388351 (1983-06-01), Sawyer
patent: 4820549 (1989-04-01), Ozaki et al.
patent: 4839261 (1989-06-01), Nakazaki et al.
patent: 4902610 (1990-02-01), Shipley

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