Methods for manufacture of electronic devices

Details Methods for manufacture of electronic devices Methods for manufacture of electronic devices

1998-12-11

2000-10-31

Bueker, Richard

Etching a substrate: processes

Forming groove or hole in a substrate which is subsequently...

216 17, 216 18, H05R 300

Patent

active

061397628

ABSTRACT:
The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and etch treatments that can produce printed circuit boards and other devices that are substantially more robust and reliable than produced by prior methods.

REFERENCES:
patent: 3962496 (1976-06-01), Leech
patent: 4316322 (1982-02-01), Tranberg
patent: 4515829 (1985-05-01), Deckert et al.
patent: 4597988 (1986-07-01), Kukanskis et al.
patent: 5132038 (1992-07-01), Kukanskis et al.
patent: 5747098 (1998-05-01), Larson

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