Metal working – Piezoelectric device making
Reexamination Certificate
2007-06-26
2007-06-26
Trinh, Minh (Department: 3729)
Metal working
Piezoelectric device making
C029S025420, C029S832000, C029S834000, C310S332000, C310S358000, C156S230000
Reexamination Certificate
active
11084579
ABSTRACT:
A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 μm to 100 μm. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.
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Buhler Steven A.
Elrod Scott A.
Fitch John S.
Littau Karl A.
Solberg Scott E.
Fay Sharpe LLP
Palo Alto Research Center Incorporated
Trinh Minh
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