Methods for making semiconductor devices

Details Methods for making semiconductor devices Methods for making semiconductor devices

1974-11-15

1976-05-11

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29591, B01J 1700

Patent

active

039552705

ABSTRACT:
Ultrasonic agitation in a liquid is used in two ways in the fabrication of small semiconductor diodes. First, a silicon-containing metal layer such as platinum-silicide is removed by exposing it to a silicon etchant and then ultrasonically agitating it. Second, an array of diodes connected by a gold film back contact is separated into individual devices by ultrasonically agitating the array to break up the gold film.

REFERENCES:
patent: 3069297 (1962-12-01), Beale
patent: 3689993 (1972-09-01), Tolar
patent: 3795045 (1974-03-01), Dumas

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