Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2005-08-22
2008-12-09
Menz, Douglas M. (Department: 2891)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C438S601000, C438S674000, C257SE23149, C365S096000
Reexamination Certificate
active
07462513
ABSTRACT:
Embodiments of the invention relate to efficient formation of improved fuses and fuse arrays, such as can be used in memory devices for example, by use of a printer that transfers material to a flexible substrate. In one embodiment, a fuse is printed using an inkjet printer on a flexible substrate fed therethrough, by depositing droplets of conductive material. The droplets form a weak portion and one or more main portions. In one embodiment, the fuse may comprise a single metal material. In additional embodiments, an array of fuses can be printed by an inkjet printer in layers for use as digital memory. For example, a layer can be printed that forms fuse elements and word address conductors, an insulating layer can be printed over the fuses but leaving a window portion exposed, and a third layer can be printed over the window portions to provide bit address conductors.
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Dinsmore & Shohl LLP
Fulk Steven J.
Lexmark International Inc.
Menz Douglas M.
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