Methods for making multilayer printed circuit boards

Details Methods for making multilayer printed circuit boards Methods for making multilayer printed circuit boards

1989-08-23

1994-12-27

Woo, Jay H.

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

29848, 29858, 156161, 156285, 156382, 264261, 26427215, 26427217, 264277, 264511, B29C 4516, B29C 4514, B32B 1704

Patent

active

053763262

ABSTRACT:
A method for making a multilayered printed circuit board including the steps of arranging two plates in spaced relation, arranging a perimetral seal between the two plates with an upper opening in the seal to form an upwardly open chamber, placing a plurality of printed circuit boards between the plates in spaced relation to one another, placing the chamber under vacuum, injecting a settable matrix material into the chamber, compressing the end plates towards one another to achieve the desired outer dimensions of the board, and curing the settable matrix material.

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