Methods for making millichannel substrate, and cooling...

Details Methods for making millichannel substrate, and cooling... Methods for making millichannel substrate, and cooling...

2011-03-01

2011-03-01

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679530, C361S700000, C165S080400, C029S890030, C029S890039, C029S890090

Reexamination Certificate

active

07898807

ABSTRACT:
A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

REFERENCES:
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5142441 (1992-08-01), Seibold et al.
patent: 5692558 (1997-12-01), Hamilton et al.
patent: 5876582 (1999-03-01), Frazier
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 6014312 (2000-01-01), Schulz-Harder et al.
patent: 6101715 (2000-08-01), Fuesser et al.
patent: 6166937 (2000-12-01), Yamamura et al.
patent: 6253835 (2001-07-01), Chu et al.
patent: 6344686 (2002-02-01), Schaeffer et al.
patent: 6373705 (2002-04-01), Koelle et al.
patent: 6377457 (2002-04-01), Seshan et al.
patent: 6388317 (2002-05-01), Reese
patent: 6490159 (2002-12-01), Goenka et al.
patent: 6582987 (2003-06-01), Jun et al.
patent: 6586783 (2003-07-01), Boursat et al.
patent: 6903929 (2005-06-01), Prasher et al.
patent: 6986382 (2006-01-01), Upadhya et al.
patent: 6991024 (2006-01-01), Goodson et al.
patent: 7141741 (2006-11-01), Yamada et al.
patent: 7189449 (2007-03-01), Osanai et al.
patent: 7277284 (2007-10-01), Lee et al.
patent: 7353859 (2008-04-01), Stevanovic et al.
patent: 7427566 (2008-09-01), Durocher et al.
patent: 7476606 (2009-01-01), Tran et al.
patent: 2003/0156969 (2003-08-01), Choi et al.
patent: 2004/0080055 (2004-04-01), Jiang
patent: 2005/0141195 (2005-06-01), Pokharna et al.
patent: 2006/0108098 (2006-05-01), Stevanovic et al.
patent: 2007/0007280 (2007-01-01), Bayerer
patent: 2007/0045801 (2007-03-01), Sugiyama et al.
patent: 2007/0215325 (2007-09-01), Solovitz et al.
patent: 2007/0235744 (2007-10-01), Tran et al.
patent: 2008/0079021 (2008-04-01), Bayerer et al.
patent: WO03003520 (2003-01-01), None

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