Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-10-10
2006-10-10
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S405000, C438S458000
Reexamination Certificate
active
07118990
ABSTRACT:
A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.
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Buhler Steven A.
Elrod Scott A.
Littau Karl A.
Solberg Scott E.
Weisberg Michael C.
Dang Phuc T.
Palo Alto Research Center Incorporated
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