Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1993-12-09
1997-02-25
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4271262, 427259, 427282, 29874, 29877, 174260, 174261, 174262, 361767, 204490, 204493, B05D 512, H01R 4316
Patent
active
056057156
ABSTRACT:
The invention provides a method for making an electrical circuit device as well as a resulting device itself. The method includes the steps of forming a base or substrate of conductive metal and then securing an electrically conductive masking element to the substrate. The resulting product is coated with a layer of fusible particles of a dielectric or resistive material that is repelled by the surface of the masking element. The coated product is then heated to fuse the particles and provide a hard dielectric or resistive layer over surface portions of the base. The masking element provides an exposed conductive path to the base metal or substrate. A section of conductive metal foil may be bonded to the masking element to provide a continuous conductive bus on the substrate.
REFERENCES:
patent: 2859321 (1958-11-01), Garaway
patent: 3473146 (1969-10-01), Mulligan
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 3575838 (1971-04-01), Hughes
patent: 3841986 (1974-10-01), Rion et al.
patent: 3928837 (1975-12-01), Esper et al.
patent: 3935088 (1976-01-01), Kaup et al.
patent: 4033832 (1977-07-01), Sterling
patent: 4085021 (1978-04-01), van der Vliet
patent: 4172733 (1979-10-01), Moritsu et al.
patent: 4188415 (1980-02-01), Takahashi et al.
patent: 4256796 (1981-03-01), Hang et al.
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4328614 (1982-05-01), Schelhorn
patent: 4342020 (1982-07-01), Utner et al.
patent: 4358541 (1982-11-01), Andrus et al.
patent: 4361651 (1982-11-01), Ohmura et al.
patent: 4365168 (1982-12-01), Chaput
patent: 4371861 (1983-02-01), Lipp et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4827769 (1989-05-01), Riley et al.
patent: 4997698 (1991-03-01), Oboodi et al.
patent: 5002903 (1991-03-01), Lim et al.
patent: 5192940 (1993-03-01), Yajima et al.
Giardina Richard N.
Herbert Joseph J.
Sundberg Craig C.
Beck Shrive
Talbot Brian K.
The Erie Ceramic Arts Company
LandOfFree
Methods for making electrical circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for making electrical circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for making electrical circuit devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1972738