Methods for making electrical circuit devices

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

4271262, 427259, 427282, 29874, 29877, 174260, 174261, 174262, 361767, 204490, 204493, B05D 512, H01R 4316

Patent

active

056057156

ABSTRACT:
The invention provides a method for making an electrical circuit device as well as a resulting device itself. The method includes the steps of forming a base or substrate of conductive metal and then securing an electrically conductive masking element to the substrate. The resulting product is coated with a layer of fusible particles of a dielectric or resistive material that is repelled by the surface of the masking element. The coated product is then heated to fuse the particles and provide a hard dielectric or resistive layer over surface portions of the base. The masking element provides an exposed conductive path to the base metal or substrate. A section of conductive metal foil may be bonded to the masking element to provide a continuous conductive bus on the substrate.

REFERENCES:
patent: 2859321 (1958-11-01), Garaway
patent: 3473146 (1969-10-01), Mulligan
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 3575838 (1971-04-01), Hughes
patent: 3841986 (1974-10-01), Rion et al.
patent: 3928837 (1975-12-01), Esper et al.
patent: 3935088 (1976-01-01), Kaup et al.
patent: 4033832 (1977-07-01), Sterling
patent: 4085021 (1978-04-01), van der Vliet
patent: 4172733 (1979-10-01), Moritsu et al.
patent: 4188415 (1980-02-01), Takahashi et al.
patent: 4256796 (1981-03-01), Hang et al.
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4328614 (1982-05-01), Schelhorn
patent: 4342020 (1982-07-01), Utner et al.
patent: 4358541 (1982-11-01), Andrus et al.
patent: 4361651 (1982-11-01), Ohmura et al.
patent: 4365168 (1982-12-01), Chaput
patent: 4371861 (1983-02-01), Lipp et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4827769 (1989-05-01), Riley et al.
patent: 4997698 (1991-03-01), Oboodi et al.
patent: 5002903 (1991-03-01), Lim et al.
patent: 5192940 (1993-03-01), Yajima et al.

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