Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-11-07
2006-11-07
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S004500, C228S044700, C228S212000
Reexamination Certificate
active
07131568
ABSTRACT:
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.
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Johnson Jonathan
TraskBritt
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