Methods for joining copper or its alloys

Details Methods for joining copper or its alloys Methods for joining copper or its alloys

1993-06-04

1995-08-08

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

228224, 2282481, H05K 334

Patent

active

054391644

ABSTRACT:
The copper or its alloys can be bonded to each other or can be bonded to noble metals or to other metals whose surface is covered with a noble metal thin film in an oxidative atmosphere. The surface of the copper or its alloys to be bonded should be covered with the layer of a noble metal thin film or a metal oxide remover or a conductive paste mainly consisting of a copper or copper alloy particles and the metal oxide remover. This method can be applied to a metallurgical industry and also to an electronics industry. This method is especially suitable for the production of a multilayered printed wiring board.

REFERENCES:
patent: 4228944 (1980-10-01), Inamura et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4569876 (1986-02-01), Nakakita
patent: 4768787 (1988-09-01), Shira
Low-Temperature Solid-State Bonding of Copper, Journal of Materials Engineering and Performance, No. 1, Feb. 1, 1992, pp. 35-44.

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