Methods for ink-jet printing circuitry

Details Methods for ink-jet printing circuitry Methods for ink-jet printing circuitry

2002-03-26

2008-10-28

Meeks, Timothy (Department: 1792)

Coating processes

Solid particles or fibers applied

Uniting particles to form continuous coating with...

C427S160000, C427S191000, C427S192000

Reexamination Certificate

active

07442408

ABSTRACT:
The present invention is drawn toward a method of forming conductive paths on a substrate using ink-jet technology. An ink-jettable suspension or solution can be formed containing a conductive particulate having certain desired conductive properties. The suspension can then be ink-jetted onto a substrate such as ceramic, epoxy glass, or other materials in a given pattern using various ink-jet printing technologies and methods. Depending on the chosen conductive particulates, suspension components, and substrate, the printed pattern of conductive particulates may then be heated to further enhance the conductive properties of the particulates through bonding and/or sintering.

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