Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-04-12
2011-04-12
Rahmjoo, Mike (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S144000, C382S141000, C382S147000, C382S148000, C382S151000, C356S394000, C356S388000, C356S429000
Reexamination Certificate
active
07925072
ABSTRACT:
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
REFERENCES:
patent: 4579455 (1986-04-01), Levy et al.
patent: 4845558 (1989-07-01), Tsai et al.
patent: 5521987 (1996-05-01), Masaki
patent: 6104835 (2000-08-01), Han
patent: 6650779 (2003-11-01), Vachtesvanos et al.
patent: 6804381 (2004-10-01), Pan et al.
patent: 6855381 (2005-02-01), Dietrich et al.
patent: 6865288 (2005-03-01), Shishido et al.
patent: 6930782 (2005-08-01), Yi et al.
patent: 6947587 (2005-09-01), Maeda et al.
patent: 7065239 (2006-06-01), Maayah et al.
patent: 7142992 (2006-11-01), Huet et al.
patent: 2002/0028013 (2002-03-01), Sawa et al.
patent: 2003/0076989 (2003-04-01), Maayah et al.
patent: 2004/0054432 (2004-03-01), Simmons
patent: 2004/0156539 (2004-08-01), Jansson et al.
patent: 2005/0062963 (2005-03-01), Yoshida et al.
patent: 2005/0104017 (2005-05-01), Kimba et al.
patent: 2006/0062445 (2006-03-01), Verma et al.
patent: 2006/0138343 (2006-06-01), Nakasuji et al.
patent: 2007/0280526 (2007-12-01), Malik et al.
patent: 16308962 (2006-03-01), None
patent: 01086529 (1989-03-01), None
patent: WO 02/086804 (2002-10-01), None
U.S. Appl. No. 11/561,735, filed Nov. 20, 2006, Kulkarni et al.
U.S. Appl. No. 11/680,152, filed Feb. 28, 2007, Chen et al.
U.S. Appl. No. 11/561,659, filed Nov. 20, 2006, Zafar et al.
International Search Report and Written Opinion for PCT/US08/55232 mailed on Jul. 4, 2008.
International Search Report and Written Opinion for PCT/US08/56212 mailed on Jul. 31, 2008.
Chen Chien-Huei (Adam)
Cook Michael
Gupta Ajay
Namjoshi Kaustubh (Kaust)
Van Riet Mike
KLA-Tencor Technologies Corp.
Mewherter Ann Marie
Rahmjoo Mike
LandOfFree
Methods for identifying array areas in dies formed on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for identifying array areas in dies formed on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for identifying array areas in dies formed on a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2722135