Methods for forming wiring and electrode

Details Methods for forming wiring and electrode Methods for forming wiring and electrode

2006-07-04

2006-07-04

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

Reexamination Certificate

active

07071084

ABSTRACT:
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.

REFERENCES:
patent: 5793479 (1998-08-01), Sugai et al.
patent: 5861189 (1999-01-01), Sheel et al.
patent: 2003/0224152 (2003-12-01), Yokoyama et al.
J. K. Ruff, et al., J. Amer. Chem. Soc., vol. 82, pp. 2141-2144, “The Amine Complexes of Aluminum Hydride”, 1960.
G. W. Fraser, et al., J. Chem. Soc., pp. 3742-3749, “Aluminium Hydride Adducts of Trimethylamine: Vibrational Spectra and Structure”, 1963.
J. L. Atwood, et al., J. Amer. Chem. Soc., vol. 113, No. 21, pp. 8183-8185, “Tertiary Amine Stabilized Dialane”, 1991.

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