Methods for forming via shielding

Details Methods for forming via shielding Methods for forming via shielding

2007-01-30

2007-01-30

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C029S847000, C174S262000, C427S097200

Reexamination Certificate

active

10234772

ABSTRACT:
Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.

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