Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2001-04-10
2003-09-30
Coleman, William David (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S029000, C438S037000, C438S046000, C438S048000
Reexamination Certificate
active
06627469
ABSTRACT:
BACKGROUND AND SUMMARY
The present invention relates to techniques for formation of shaped structures on a semiconductor substrate. More particularly, one application of such shaped structures is to form structures which alter some aspect of an electromagnetic beam produced by the semiconductor. One example is a semiconductor lens.
Much interest has been recently placed on formation of optical structures using semiconductors. Semiconductor light emitting diodes (“LEDs”) and vertical cavity surface emitting devices (“VCSELs”) are known. These devices produce electromagnetic radiation, e.g., Infra Red (“IR”) radiation, or light, from a semiconductor device.
The light produced by the semiconductor device must be coupled from the semiconductor device into a light channeling element, as air or a light channeling fiber. However, the actual coupling of the light can cause internal reflection at the interface between the semiconductor light emitting device and the medium such as air. In certain cases, the light can be totally internally reflected, resulting in very low coupling efficiency.
It is known to use a lensing element as part of a semiconductor. For example, U.S. Pat. No. 5,023,447 explains that it is desirable to use a semispherical lens in a semiconductor. However, the lens is separately formed and glued into place.
The present disclosure describes formation and use of a optical property altering device, e.g., a lens, out of a portion of the semiconductor substrate.
For example, the device as described herein forms a hemispherical cap at the top surface. This hemispherical cap acts as a lens to alter the optical characteristics.
REFERENCES:
patent: 4367483 (1983-01-01), Takahashi et al.
patent: 5023447 (1991-06-01), Masuko et al.
patent: 5633527 (1997-05-01), Lear
Cheng Chuan-cheng
O'Brien John
Scherer Axel
Xu Yong
Yariv Amnon
California Institute of Technology
Coleman William David
Lee Hsien Ming
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