Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-08-01
2006-08-01
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
Reexamination Certificate
active
07084013
ABSTRACT:
Methods for forming protective layers on semiconductor devices, including semiconductor devices that are carried by fabrication substrates, that are parts of assemblies, and that include individual dies, include at least partially consolidating previously unconsolidated material selectively, in accordance with a program. The method may include use of a machine vision system or other object recognition apparatus to provide precise die-specific alignment. A protective structure may be formed to include at least one layer or segment of dielectric material having a controlled thickness or depth and a precise boundary. The layer or segment may include precisely sized, shaped, and located apertures through which conductive terminals, such as bond pads, on the surface of the die may be accessed. Dielectric material may also be employed as a structure to mechanically reinforce a die-to-substrate (e.g., die-to-lead frame) attachment.
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Farnworth Warren M.
Wood Alan G.
Micro)n Technology, Inc.
TraskBritt
Zarneke David A.
LandOfFree
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