Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2006-06-20
2006-06-20
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S746000
Reexamination Certificate
active
07064082
ABSTRACT:
The present invention pertains to a more efficient system and method for forming rectifying junction contacts in PIN alloy-semiconductor devices using photoelectrical and chemical etching. The present invention provides a means of creating rectifying junction contacts on alloy-semiconductor devices such as CdTe and CdZnTe, among others. In addition, the present invention also provides a simple and low cost method for revealing wafer surface morphology of alloy-semiconductors, thus providing an efficient and effective means for selecting single grain semiconductor substrates. Further, the present invention provides radiation detectors employing such alloy-semiconductor devices having improved rectifying junctions as the detector element.
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Chen Kuo-Tong
Polichar Raulf M.
Duong Khanh
Kilpatrick & Stockton LLP
Science Applications International Corporation
Smith Zandra V.
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