Methods for forming MOS capacitors

Details Methods for forming MOS capacitors Methods for forming MOS capacitors

2008-01-04

2010-11-23

Wojciechowicz, Edward (Department: 2895)

Semiconductor device manufacturing: process

Making passive device

Planar capacitor

C438S210000, C438S239000, C257S296000, C257S532000

Reexamination Certificate

active

07838383

ABSTRACT:
Method (200) and apparatus (30, 50-53) are described for MOS capacitors (MOS CAPs). The apparatus (30, 50-53) comprises a substrate (31) having Ohmically coupled N and P semiconductor regions (32, 34; 54, 56; 92, 94) covered by a dielectric (35, 57, 95). A conductive electrode (36, 58, 96) overlies the dielectric (35, 57, 95) above these N and P regions (32, 34; 54, 56; 92, 94). Use of the Ohmically coupled N and P regions (32, 34; 54, 56; 92, 94) substantially reduces the variation (40, 64, 70, 80) of capacitance with applied voltage associated with ordinary MOS CAPs. When these N and P regions (32, 34; 54, 56; 92, 94) have unequal doping, the capacitance variation (40, 64, 70, 80) may still be substantially compensated by adjusting the properties of the dielectric (57, 95) above the N and P regions (54, 56; 92, 94) and/or relative areas of the N and P regions (54, 56; 92, 94) or both. Accordingly, such MOS CAPS may be more easily integrated with other semiconductor devices with minimal or no disturbance to the established integrated circuit (IC) manufacturing process and without significantly increasing the occupied area beyond that required for a conventional MOS CAP.

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St. Onge, S.,et al., Design of Precision Capacitors for Analog Applications, IEEE Transactions of Components, Hybrids, and Manufacturing Technology, vol. 15. No. 6, Dec. 1992.

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