Methods for forming gas barriers on electronic devices

Details Methods for forming gas barriers on electronic devices Methods for forming gas barriers on electronic devices

2009-04-01

2011-10-25

Mazumdar, Sonya (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S272800, C156S275500, C156S289000, C156S297000, C156S300000, C438S022000, C438S066000

Reexamination Certificate

active

08043462

ABSTRACT:
A method for forming gas barriers on electronic devices is provided. The fabrication method includes: providing a first substrate having at least one electronic device thereon; providing a second substrate and forming a gas barrier over the second substrate; disposing the second substrate over the first substrate, wherein the gas barrier faces the electronic device; providing an electromagnetic wave light source over the second substrate; and irradiating the second substrate by the electromagnetic wave light source to transfer the gas barrier to the electronic device and cover the electronic device.

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English Translation of DE102007040655—Doelle et al. Mar. 2009.
English translation of DE 102007040655 A1; Vissing et al.—Mar. 12, 2009.
English abstract of JP 2005347275 A; Jeong et al.—Dec. 15, 2005.

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