Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2005-05-23
2008-09-30
Le, Thao X. (Department: 2892)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S597000, C438S709000
Reexamination Certificate
active
07429536
ABSTRACT:
Methods of forming arrays of small, densely spaced holes or pillars for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form sumperimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer.
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Abatchev Mirzafer
Sandhu Gurtej
Jones Eric W
Knobbe Martens Olson & Bear LLP
Le Thao X.
MICRON Technology, Inc.
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