Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-10-02
2007-10-02
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S030000, C257SE21021, C257SE21036
Reexamination Certificate
active
10915578
ABSTRACT:
An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.
REFERENCES:
patent: 4705592 (1987-11-01), Bahrle
patent: 4735676 (1988-04-01), Iwasa
patent: 4784721 (1988-11-01), Holmen et al.
patent: 4914742 (1990-04-01), Higashi et al.
patent: 5133036 (1992-07-01), Tornqvist
patent: 5158645 (1992-10-01), Covert et al.
patent: 5244817 (1993-09-01), Hawkins et al.
patent: 5284548 (1994-02-01), Carey et al.
patent: 5364742 (1994-11-01), Fan et al.
patent: 5441139 (1995-08-01), Abe et al.
patent: 5532174 (1996-07-01), Corrigan
patent: 5559345 (1996-09-01), Kim
patent: 5616514 (1997-04-01), Muchow et al.
patent: 5701055 (1997-12-01), Nagayama et al.
patent: 6169357 (2001-01-01), Potter
patent: 6383327 (2002-05-01), Mase
patent: 6465286 (2002-10-01), Possin et al.
patent: 6547973 (2003-04-01), Field
patent: 2002/0081847 (2002-06-01), Jo et al.
patent: 2002/0127844 (2002-09-01), Grill et al.
patent: 2003/0010745 (2003-01-01), Field
patent: 2003/0010746 (2003-01-01), Gutierrez et al.
patent: 2004/0207316 (2004-10-01), Birnstock et al.
patent: 2005/0052120 (2005-03-01), Gupta et al.
patent: 0 445 881 (1991-09-01), None
patent: WO 00/48236 (2000-08-01), None
MacPherson Charles Douglas
Truong Nugent
E.I. du Pont de Nemours and Company
Everhart Caridad
Lamming John H.
LandOfFree
Methods for forming an undercut region and electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for forming an undercut region and electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for forming an undercut region and electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3822925