Methods for forming a photoresist pattern using an...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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C438S048000, C430S030000

Reexamination Certificate

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06905899

ABSTRACT:
A method is providing for forming a semiconductor device including providing a substrate having a photoresist layer formed thereon, and providing a photomask over at least a portion of the photoresist layer, the photomask having a main pattern and an assist pattern. The method further includes transferring the main pattern to the photoresist layer, and forming a pattern on the substrate in such a way that excessively rounded corners caused by the optical proximity effect (OPE) are reduced.

REFERENCES:
patent: 6686108 (2004-02-01), Inoue et al.

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