Methods for forming a conductor on a dielectric

Details Methods for forming a conductor on a dielectric Methods for forming a conductor on a dielectric

2006-04-04

2006-04-04

Norton, Nadine G. (Department: 1765)

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

C216S095000, C216S096000, C216S097000, C216S098000, C029S846000, C029S847000, C029S851000

Reexamination Certificate

active

07022251

ABSTRACT:
Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.

REFERENCES:
patent: 3808042 (1974-04-01), Dietz
patent: 4303480 (1981-12-01), Wood et al.
patent: 4806941 (1989-02-01), Knochel et al.
patent: 4808274 (1989-02-01), Nguyen
patent: 5317292 (1994-05-01), Leeb
patent: 5357138 (1994-10-01), Kobayashi
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5910334 (1999-06-01), Lautzenhiser et al.
patent: 6000120 (1999-12-01), Arledge et al.
patent: 6255730 (2001-07-01), Dove et al.
patent: 6353189 (2002-03-01), Shimada et al.
patent: 6420778 (2002-07-01), Sinyansky
patent: 6457979 (2002-10-01), Dove et al.
patent: 2001/0012692 (2001-08-01), Miller et al.
patent: 2004/0023482 (2004-02-01), Dell'Ova et al.
patent: 2004/0257194 (2004-12-01), Casey et al.
patent: 2004/0258841 (2004-12-01), Casey et al.
patent: 03006818 (1991-01-01), None
Wolf et al., Silicon Processing for the VLSI Era, 1986, Lattice Press, vol. 1, pp. 531-535.
John F. Casey, et al., “Methods for Depositing a Thickfilm Dielectric on a Substrate”, New Patent Application (9 pages of specification, 4 pages of claims and 1 page abstract), 2 sheets of formal drawings, Filed Jun. 19, 2003.
John F. Casey, et al., “Methods for Making Microwave Circuits”, New Patent Application (30 pages of specification (21 pages of specification, 8 pages of claims and 1 page abstract), 9 sheets of formal drawings, Filed Jun. 19, 2003.

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