Methods for forming a calibration standard and calibration...

Optics: measuring and testing – Standard – Surface standard

Reexamination Certificate

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Reexamination Certificate

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07027146

ABSTRACT:
Methods for forming calibration standards for an inspection system and calibration standards are provided. One method includes scanning a first and a second specimen with an optical system. Master standard particles having a lateral dimension traceable to a national or international authority or first principles measurements are deposited on the first specimen. Product standard particles are deposited on the second specimen. In addition, the method includes determining a lateral dimension of the product standard particles by comparing data generated by scanning the two specimens. One calibration standard includes particles having a lateral dimension of less than about 100 nm deposited on a specimen. A distribution of the lateral dimension has a full width at half maximum of less than about 3%. The uncertainty of the lateral dimension is less than about 2%. Therefore, the standard meets the requirements for the 130 nm technology generation of semiconductor devices.

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SEMI Draft Document 3094, “New Standard: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130-nm Technology Generation,” Jan. 2002, pp. 1-14.
SEMI Draft Document 3388, “New Standard: Practice for Calibrating Scanning Surface Inspection Systems using Certified Depositions on Monodisperse Polystyrene Latex Sphere on Unpatterened Semiconductor Wafer Surfaces,” May 2002, pp. 1-10.
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National Institute of Standards & Technology, Certificate of Analysis, Standard Reference Material® 1963, Jan. 2001, 2 pages.

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