Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-01-11
2005-01-11
Elms, Richard (Department: 2824)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S106000, C438S125000, C438S126000, C438S121000, C438S124000
Reexamination Certificate
active
06841423
ABSTRACT:
A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface. A microelectronic device is disposed in the cavity and is supported in the cavity with a removable retention member. The microelectronic device is electrically coupled to the support member and is partially surrounded with an encapsulating material. The removable retention member is then removed to expose a surface of the microelectronic device. Accordingly, the package can have a low profile because the encapsulating material does not surround one of the microelectronic device surfaces. In one embodiment, a heat conductive material can be engaged with the exposed surface of the microelectronic device to increase the rate at which heat is transferred away from the microelectronic device.
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