Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-08-28
2007-08-28
Norris, Jeremy C (Department: 2841)
Metal working
Method of mechanical manufacture
Electrical device making
C029S843000, C029S848000, C228S180100, C228S180210
Reexamination Certificate
active
10402315
ABSTRACT:
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-axis connection. The single sided conductive layer is a bus layer to form z axis conductive stud within the high and low temperature LCP, followed by a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis connection. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer.
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Dalmia Sidharth
Sundaram Venkatesh
Swaminathan Madhavan
White George E.
Georgia Tech Research Corporation
Norris Jeremy C
Sutherland & Asbill & Brennan LLP
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