Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-01-06
2008-09-09
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S843000, C029S725000, C029S890030, C165S104330, C257S712000
Reexamination Certificate
active
07421780
ABSTRACT:
Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet form, and stamping a microchannel structure having a plurality of outer walls enclosing a predefined area from the blank. The microchannel structure may then be bonded to a heat dissipating side opposite from a micro-component device facing side of a first substrate, the micro-component device facing side of the first substrate being adapted to thermally engage with the micro-component device. The microchannel structure may then be bonded to a second substrate opposite the first substrate, resulting in a closed volume microchannel being defined. Finally, the defined microchannel may then be substantially filled with a fluid thermal interface material.
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Houle Sabina
Matayabas, Jr. James C.
Intel Corporation
Nguyen Donghai D.
Schwabe Williamson & Wyatt P.C.
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