Methods for fabricating solderless printed wiring devices

Details Methods for fabricating solderless printed wiring devices Methods for fabricating solderless printed wiring devices

1996-10-10

1998-11-24

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29841, 29846, 29852, 29DIG12, 174259, 174260, 2281791, 22818021, 361779, 427 97, 427 98, H05K 332, H05K 310, H05K 342

Patent

active

058391908

ABSTRACT:
Methods for making a printed wiring device including a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected by a metal layer plated on the lead and on the member and forming an electrically conductive path between the lead and the member.

REFERENCES:
patent: 4132341 (1979-01-01), Bratschun
patent: 4722470 (1988-02-01), Johary
patent: 4814944 (1989-03-01), Sagawa et al.
patent: 5052102 (1991-10-01), Fong et al.
patent: 5079835 (1992-01-01), Lan
patent: 5283947 (1994-02-01), Santo et al.
patent: 5414928 (1995-05-01), Bonitz et al.

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